Monday, July 9, 2007
Staktek Announces Chip Packaging Technology
Austin, Texas-based Staktek Holdings, a provider of technology for the semiconductor packaging market, said today that it has announced a new platform focused on the multi-die packaging market. The firm said that its technology improves testability and electrical performance for die stacking. Die stacking is a part of the semiconductor packaging process, used for creating products such as DDR3 DRAM memory, Flash memory, and multi-chip modules. Die stacking is used to create more complex semiconductors by joining multiple semiconductor layers in a single package. The firm said the new technology, the DSD-Pak technology platform, has been demonstrated in a Flash packaging solution.